Professor Yu Wang was a faculty in the department of electrical engineering at Dalian Jiaotong University, China for seven years before coming to the U.S. Her B.S and M.S degrees are from Liaoning University and from Dalian University of Technology in China in the areas of Physics and Optoelectronics respectively. She received her M.S. in Electrical Engineering from The City College of New York and her Ph.D. in Electrical Engineering from the CUNY Graduate Center. Before joining CityTech, she taught at CCNY and was part of a research team that develops formal models for the behavior of real-time systems. Her areas of interest includes Formal methods for modeling real-time systems, Test automation for network protocols and embedded systems, Computer communication networks, Fiber optical communication and optoelectronics.
• CET 4964 Optical Technology
• CET 4805 Component and Subsystem Design
• EMT 1250L Digital Control Lab
• EMT 1150L Electrical Circuit Lab
• Y. Wang, M. U. Uyar, S. S. Batth, and M. A. Fecko, “Fault masking
by multiple timing faults in timed EFSM models,” in Computer
Networks, Vol. 53, Issue 5, pp. 596-612, April, 2009,
doi:10.1016/j.comnet.2008.10.025.
• S. S. Batth, M. U. Uyar, Y. Wang and M. A. Fecko, “Fault Modeling
and Detection Capabilities for EFSM Models,” in IEEE
Transactions on Instrumentation and Measurement,, Vol. 57,
Issue 6, pp. 1102-1111, June 2008.
• M. U. Uyar, Samrat S. Batth, Y. Wang, and M. A. Fecko,
“Algorithms for modeling a class of single timing faults in
communication protocols ,” in IEEE Transactions on Computers,
Vol. 57, Issue 2, pp. 274-288, Feb 2008.
• M. U. Uyar, Y. Wang, S. S. Batth, A. Wise, and M. A. Fecko,
“Timing fault models for systems with multiple timers ,” in Proc.
IFIP Int’l Conf. Testing Communication Systems (TestCom),
Lecture Notes in Computer Science, Vol. 3502, pp. 192-208,
May 2005
• M. U. Uyar, Y. Wang, S. S. Batth, A. Wise, and M. A. Fecko,
“Single fault models for timed FSMs,” in Proc. IEEE
Instrumentation and Measurement Technology Conf. (IMTC),
Vol. 3, Ottawa, Canada, pp. 2349-2354, May 2005
• IEEE (Institute of Electrical and Electronic Engineers)